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Thermal Simulation
Understand how heat flows through your design — predict temperature rise, hotspots, thermal gradients, and heat-induced deformation long before physical testing. Optimise cooling, reliability, and performance using advanced numerical thermal modelling.
What Is Thermal Simulation?
Thermal Simulation models how heat is generated, transferred, and dissipated within a system. Using Finite Element Analysis (FEA), Computational Fluid Dynamics (CFD) and conduction–convection–radiation solvers, we reveal temperature fields, heat flux paths, cooling performance, reliability under thermal cycling, and thermo-mechanical behaviour.
Why It Matters
- Prevent overheating: Identify hotspots before they lead to failures in electronics or mechanical components.
- Improve thermal efficiency: Optimise heat sinks, airflow paths, insulation, and material choices.
- Enhance product life: Predict long-term thermal fatigue and reliability under cycling conditions.
- Reduce prototyping: Validate thermal performance virtually and save cost/time on physical tests.
- Assure compliance: Validate designs against IEC, JEDEC, MIL-STD and other temperature-related regulations.
60%
Reduction in overheating-related failures
30%
Improved cooling efficiency after optimisation
4×
Faster validation vs physical thermal testing
Our Simulation Process
Requirement Mapping: Heat loads, power dissipation, ambient conditions, duty cycles and thermal constraints.
Geometry Preparation: Clean-up, simplification, modelling thermal interfaces and insulation boundaries.
Material Definition: Temperature-dependent conductivity, heat capacity, convection coefficients, emissivity data.
Meshing: Fine-grained thermal meshes with refinement around hotspots, chips, welds and thin layers.
Boundary Setup: Convection, radiation, heat generation, Joule heating, contact resistance & thermal interfaces.
Solver Execution: Steady-state, transient, coupled thermo-mechanical or CFD-assisted thermal predictions.
Interpretation: Temperature distribution, heat flux vectors, thermal resistance mapping and hotspot diagnosis.
Optimisation: Improving heat sink geometry, airflow, insulation, PCB layout, and material selection.
What We Can Simulate
- Steady-state thermal analysis – stable temperature distribution and heat paths.
- Transient heating & cooling – warm-up, cool-down, and duty-cycle simulations.
- Electronics thermal analysis – chips, MOSFETs, IGBTs, PCBs, BGA packaging.
- Cooling system simulation – heat sinks, fans, ducts, liquid cooling, vapor chambers.
- Thermo-mechanical coupling – thermal expansion, warping, stress from heating.
- Radiation-dominant systems – furnaces, high-temperature enclosures, aerospace.
- Battery thermal runaway – localized hotspots and cascading heating behaviour.
- CFD-assisted thermal studies – convection behaviour and airflow mapping.
Scientific References
Thermal Management in Electronic Systems
IEEE Transactions on Components, 2022 — Focuses on heat dissipation, cooling, and reliability in high-power electronics.
IEEE Transactions on Components, 2022 — Focuses on heat dissipation, cooling, and reliability in high-power electronics.
Coupled Thermal–Mechanical Behaviour of Structures
Journal of Thermal Stresses, 2021 — Insights into deformation and stress caused by thermal gradients.
Journal of Thermal Stresses, 2021 — Insights into deformation and stress caused by thermal gradients.
CFD-Based Thermal Modelling for Complex Systems
International Journal of Heat and Mass Transfer, 2020 — Explores advanced convection and airflow modelling.
International Journal of Heat and Mass Transfer, 2020 — Explores advanced convection and airflow modelling.
Need Accurate Thermal Insights?
Predict heat behaviour, eliminate hotspots, and improve your product’s reliability and lifespan.
Get a Thermal Simulation QuoteBack to Services
Thermal Simulation
Understand how heat flows through your design — predict temperature rise, hotspots, thermal gradients, and heat-induced deformation long before physical testing. Optimise cooling, reliability, and performance using advanced numerical thermal modelling.
What Is Thermal Simulation?
Thermal Simulation models how heat is generated, transferred, and dissipated within a system. Using Finite Element Analysis (FEA), Computational Fluid Dynamics (CFD) and conduction–convection–radiation solvers, we reveal temperature fields, heat flux paths, cooling performance, reliability under thermal cycling, and thermo-mechanical behaviour.
Why It Matters
- Prevent overheating: Identify hotspots before they lead to failures in electronics or mechanical components.
- Improve thermal efficiency: Optimise heat sinks, airflow paths, insulation, and material choices.
- Enhance product life: Predict long-term thermal fatigue and reliability under cycling conditions.
- Reduce prototyping: Validate thermal performance virtually and save cost/time on physical tests.
- Assure compliance: Validate designs against IEC, JEDEC, MIL-STD and other temperature-related regulations.
60%
Reduction in overheating-related failures
30%
Improved cooling efficiency after optimisation
4×
Faster validation vs physical thermal testing
Our Simulation Process
Requirement Mapping: Heat loads, power dissipation, ambient conditions, duty cycles and thermal constraints.
Geometry Preparation: Clean-up, simplification, modelling thermal interfaces and insulation boundaries.
Material Definition: Temperature-dependent conductivity, heat capacity, convection coefficients, emissivity data.
Meshing: Fine-grained thermal meshes with refinement around hotspots, chips, welds and thin layers.
Boundary Setup: Convection, radiation, heat generation, Joule heating, contact resistance & thermal interfaces.
Solver Execution: Steady-state, transient, coupled thermo-mechanical or CFD-assisted thermal predictions.
Interpretation: Temperature distribution, heat flux vectors, thermal resistance mapping and hotspot diagnosis.
Optimisation: Improving heat sink geometry, airflow, insulation, PCB layout, and material selection.
What We Can Simulate
- Steady-state thermal analysis – stable temperature distribution and heat paths.
- Transient heating & cooling – warm-up, cool-down, and duty-cycle simulations.
- Electronics thermal analysis – chips, MOSFETs, IGBTs, PCBs, BGA packaging.
- Cooling system simulation – heat sinks, fans, ducts, liquid cooling, vapor chambers.
- Thermo-mechanical coupling – thermal expansion, warping, stress from heating.
- Radiation-dominant systems – furnaces, high-temperature enclosures, aerospace.
- Battery thermal runaway – localized hotspots and cascading heating behaviour.
- CFD-assisted thermal studies – convection behaviour and airflow mapping.
Scientific References
Thermal Management in Electronic Systems
IEEE Transactions on Components, 2022 — Focuses on heat dissipation, cooling, and reliability in high-power electronics.
IEEE Transactions on Components, 2022 — Focuses on heat dissipation, cooling, and reliability in high-power electronics.
Coupled Thermal–Mechanical Behaviour of Structures
Journal of Thermal Stresses, 2021 — Insights into deformation and stress caused by thermal gradients.
Journal of Thermal Stresses, 2021 — Insights into deformation and stress caused by thermal gradients.
CFD-Based Thermal Modelling for Complex Systems
International Journal of Heat and Mass Transfer, 2020 — Explores advanced convection and airflow modelling.
International Journal of Heat and Mass Transfer, 2020 — Explores advanced convection and airflow modelling.
Need Accurate Thermal Insights?
Predict heat behaviour, eliminate hotspots, and improve your product’s reliability and lifespan.
Get a Thermal Simulation Quote